The Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum), organized by the Shenzhen Memory Industry Association and School of Integrated Circuits at Peking University and co-organized by JWinsights (Shanghai) Technology Co., Ltd., was recently concluded in Renaissance Shenzhen Bay Hotel. The summit announced the GMIF2025 Annual Awards, recognizing excellence across multiple dimensions, including storage technologies, solutions, and AI applications.
Leading companies such as Samsung Semiconductor, KIOXIA, Sandisk, Solidigm, Arm, Intel, MediaTek, YMTC, CXMT, BIWIN, Silicon Motion, Maxio Technology, InnoGrit, Montage Technology, iFLYTEK, GreaTech Substrates, Loongson Technology, China Greatwall, LKAUTO, Heyan Technology, TOPDISK, KingSpec, POWEV, Microview, Maxwell Technologies, Silergy, Skyverse, AMIES, Hemei Jingyi, Tytantest, APIE, OKN Technology, Quanxing Technology, Greater Bay Advanced Technology, XING YUN, Yanxin Microelectronics, and UNIMOS stood out for their outstanding achievements in technological innovation, product breakthroughs, industry collaboration, and ecosystem development.
The GMIF2025 Awards comprise over 37 sub-awards across three major categories: International Leadership, China's Strength, and Ecosystem & Industrial Innovation. The full list of winners is as follows:
International Leadership
This category honors global storage industry leaders for their exceptional contributions to computing power enhancement, compute-storage convergence, and AI storage, showcasing the core driving forces behind industry progress.
Outstanding Storage Technology Leadership Award: Samsung Semiconductor
Samsung Semiconductor, as a leading company in global storage and memory industry, pioneers in storage technologies and achieves technological iteration and scale breakthrough in DRAM and NAND sector. In response to the high-bandwidth, energy efficiency, and reliability demands in the AI era, Samsung takes the lead in the mass production and application of HBM, DDR5, LPDDR5X and high-layer 3D NAND technologies, empowering more crucial scenarios such as large-model training, data center expansion, and terminal innovation. Its technical blueprint reshapes the boundary of memory performance and energy efficiency, and provides solid solution support for global customers. Bolstered by its on-going R&D investment and industry leadership, Samsung Semiconductor has made remarkable contributions to the advancement of the global storage industry and AI application deployment.
Outstanding NAND Technology Pioneer Award: KIOXIA
As the inventor of NAND flash, KIOXIA continues to lead 3D NAND innovation. Its 8th-generation BiCS FLASH™, leveraging advanced processes like CBA (CMOS directly Bonded to Array) and lateral scaling, significantly enhances TLC and QLC performance. Notably, QLC achieves a single-die capacity of 2Tb, enabling 8TB per chip through 32-layer stacking and paving the way for 256TB 2.5-inch SSDs, supporting AI and data center applications. KIOXIA’s forward-looking technology and leadership solidify its position as a global NAND pioneer.
Outstanding AI Storage Pioneer Award: Sandisk
Sandisk drives the evolution of storage architectures in the AI era through technological innovation. The company has launched high-speed flash solutions to meet the bandwidth needs of large models and edge computing, introduced a 256TB NVMe SSD that sets new benchmarks for capacity and efficiency, and developed automotive-grade UFS 4.1 embedded flash for AI-powered vehicle systems. With continuous innovation and strategic foresight, Sandisk is shaping the future of the storage ecosystem.
Outstanding SSD Technology Innovation Award: Solidigm
Solidigm focuses on enterprise-grade SSDs, leading storage innovation with QLC’s large-scale adoption in enterprise applications. Its ultra-high-capacity, energy-efficient SSDs provide reliable support for AI training, inference, and massive data processing. Balancing performance and cost, Solidigm’s solutions significantly enhance data center and AI workload efficiency. Through sustained R&D and ecosystem collaboration, Solidigm continues to drive global SSD technology innovation.
Outstanding Computing Architecture Innovation Award: Arm
Arm advances global intelligent computing and storage through continuous architectural innovation. Leading in high-performance, low-power processor design, Arm has made breakthroughs in AI inference, edge computing, and storage interface synergy, providing robust support for smart devices, automotive electronics, and data centers. By integrating computing power with energy efficiency, Arm accelerates AI and storage application deployment. Its forward-looking R&D and global ecosystem collaboration make it a key force in compute-storage innovation.
Outstanding Storage-Computing Collaborative Innovation Award: Intel
Intel drives compute-storage convergence with groundbreaking innovations in CXL memory pooling, near-memory computing, and heterogeneous computing architectures. Its solutions address AI and scientific computing challenges related to bandwidth, latency, and energy efficiency, delivering new momentum for data centers and edge applications. Through processor platforms and full-stack ecosystems, Intel redefines system efficiency. Its global influence and sustained innovation make it a leader in compute-storage synergy and industry advancement.
Outstanding AI Ecosystem Empowerment Award: MediaTek Inc.
As a global leader in smart device chips, MediaTek plays a pivotal role in AI-powered smartphones, AI PCs, and connected devices. Its high-performance SoCs support the latest storage interfaces and standards, delivering higher bandwidth, lower power consumption, and superior user experiences. By enabling efficient compute-storage synergy, MediaTek drives innovation in imaging, voice, and multimodal interactions for AI applications. With strong market influence and continuous technological investment, MediaTek is a key enabler of the smart device ecosystem.
China's Strength
This category highlights the core forces of China’s storage industry. These enterprises, with independent innovation at their core, are driving technological breakthroughs and supply chain advancements to accelerate the development of high-end domestic storage solutions.
Outstanding Storage Technology Innovation Award: Yangtze Memory Technologies Co., Ltd. (YMTC)
YMTC has achieved comprehensive breakthroughs in 3D NAND performance, density, and efficiency with its Xtacking®4.0 architecture. These advancements enhance product quality and reliability while optimizing power consumption for enterprise and consumer applications. As a key innovator in the global semiconductor industry, YMTC continues to advance Xtacking®4.0 technology, delivering greater value to commercial clients and pushing enterprise, consumer, and embedded storage technologies to new heights.
Outstanding DRAM Industry Leadership Award: ChangXin Memory Technologies Inc. (CXMT)
As China's leading DRAM manufacturer, CXMT has successfully mass-produced DDR4, LPDDR4X/5, and other products, breaking China's reliance on imported DRAM chips. Its products are widely used in PCs and mobile devices, with steadily growing shipments and increasing market recognition. Through advancements in R&D and industrialization, CXMT drives self-reliance in the DRAM industry and injects new vitality into the global storage landscape, establishing a strategic leadership position.
Outstanding Edge AI Storage Leadership Award: Shenzhen BIWIN Storage Technology Co., Ltd.
As a publicly listed company on the STAR Market and a constituent of the STAR 50 Index, BIWIN focuses on semiconductor storage technology and advanced packaging/testing, and establishes a complete layout in edge AI area. Its self-developed eMMC/UFS controllers have achieve scale production, and revenues in edge AI applications reach over 1 billion RMB. Meanwhile, centering around its wafer-level advanced packaging and testing and Integrated Solution and Manufacturing 2.0 strategy (ISM), BIWIN concentrates on developing next-generation compute-storage convergence solutions. With technological breakthroughs, supply chain collaboration, and global customer service, BIWIN is a leader in edge AI storage and industry advancement.
Outstanding Controller Technology Innovation Award: Silicon Motion Technology Corporation
Silicon Motion, a leader in storage controllers, drives industry progress with cutting-edge technologies. It pioneered PCIe Gen5 SSD controllers and made breakthroughs in low-power architectures, firmware optimization, and AI acceleration, significantly improving performance, efficiency, and reliability. Its solutions are widely used in PCs, mobile devices, and enterprise storage, supporting the entire supply chain. Through sustained R&D and innovation, Silicon Motion remains a key driver of global controller technology.
Outstanding Storage Industry Contribution Award: Maxio Technology (Hangzhou) Co., Ltd.
Maxio Technology, a platform-based chip designer, provides data storage controllers, AIoT signal processing and transmission chips. Committed to independent R&D and iterative innovation, Maxio delivers a portfolio of high-quality, large-scale IC chips and solutions that fuel the fast growth of the digital-intelligence era. Since its founding, the company has shipped hundreds of millions of core chips, enabling trillions of RMB in end-market value and contributing to the high-quality development of the digital industry—always guided by its original vision “Empower the digital world with chips and create a better future together.”
Outstanding AI Application Technology Innovation Award: InnoGrit Corporation
InnoGrit focuses on high-end storage controller chips, covering PCIe 3.0 to 6.0, with breakthroughs in enterprise storage solutions for AI computing, big data analytics, and high-performance storage systems. InnoGrit controllers excel in enhancing system efficiency and user experience, driving advancements in storage technology and providing critical support for AI and data center applications.
Outstanding Storage Market Product Award: Montage Technology, Inc.
Montage Technology, a leading global provider of data processing and interconnect chips, offers high-performance and energy-efficient solutions for cloud computing and data centers. Its clock generator supports independently configurable output frequencies, low-jitter clock, strong drive, and spread spectrum clocking, with reference clock jitter of just 35fs, far beyond the 150fs standard of PCIe Gen5. In collaboration with BIWIN, Montage 2-channel differential output chip M88TG0102B has been successfully integrated into enterprise SSDs powered by domestic controllers, ensuring exceptional performance and reliability.
Outstanding AI Application Innovation Award: iFLYTEK Co., Ltd.
As a leader in Chinese AI, iFLYTEK drives breakthroughs in speech recognition, natural language processing, and cognitive intelligence. Its iFLYTEK Spark cognitive model empowers diverse scenarios, including education, healthcare, office, and automotive applications. By advancing human-machine interaction and cognitive intelligence, iFLYTEK accelerates AI’s transition from lab to industry, significantly improving productivity and quality of life. Its forward-looking technology and innovation make it a global leader in AI applications.
Outstanding AI Application Storage Service Award: Shenzhen Quanxing Technology Co., Ltd.
Underpinned by its self-developed AI expansion cards, algorithm platforms, and AI Studio training-inference platforms, Quanxing innovates with its AI inference and training integrated machine which integrates enterprise-grade storage and computing to expand GPU capacity. This enables mid-tier GPUs to replace high-end GPUs for full-parameter local model training, reducing deployment costs by over 90%. With its plug-and-play, offline, and one-click deployment features, it effectively addresses key challenges in AI model deployment such as data security, high costs, and excessive energy consumption. The solution has been successfully adopted across government, legal, and education sectors, empowering clients to build proprietary large models based on private data for applications including intelligent administration, AI-powered document drafting, legal assistance, and AI-driven education.
Outstanding Market Growth Award: Shenzhen Powev Electronic Technology Co., Ltd.
POWEV, with its proprietary testing systems and firmware algorithms, delivers high-performance, reliable, and cost-effective storage products under its Gloway and Asgard brands. Through vertical integration, it achieves quality and cost advantages, earning widespread consumer recognition. According to TrendForce, its global DRAM module market share rose from 4th in 2019 to 2nd in 2023, showcasing its rapid growth and leadership in driving China's storage brand prominence.
Outstanding Storage Packaging & Testing Technology Application Award: Unimos Microelectronics (Shanghai) Co., Ltd.
UNIMOS, with its accumulation in advanced packaging and testing area, provides high-reliable and high-density packaging solutions for DRAM, NAND, and SSD controller. Its breakthroughs in BGA, SiP, and FCCSP packaging technologies enable fine-pitch bonding, multi-layer stacking, and low-stress processes, meeting demands for miniaturization, high performance, large capacity, and automotive-grade applications. With robust production capabilities and stringent quality control, UNIMOS supports the self-reliance of China's storage supply chain.
Ecosystem & Industrial Innovation
This category recognizes the innovative and foundational contributions of supply chain partners in materials, equipment, manufacturing, and packaging, building a robust foundation for industry growth.
Outstanding Packaging Substrate Technology Innovation Award: GreaTech Substrates Co., Ltd. (GTS)
GTS specializes in the R&D and manufacturing of advanced packaging substrates, with breakthroughs in high-layer counts, fine lines, and low-loss technologies, successfully satisfying the packaging needs of high-end chips for AI computing, data centers and memory. Featuring high reliability and innovative capabilities, GTS fills domestic gaps and drives the localization of critical materials. Its continuous R&D investment and industry chain collaboration make GTS one of the emerging supporting power of the advanced packaging industry.
Outstanding Independent Innovation Leadership Award: Loongson Technology Corporation Limited
Loongson Technology focuses on the research and industrialization of independent CPU. Centered around its proprietary instruction system LoongArch, its processors have been widely used in critical areas such as PC, server, industrial control, and information security, providing solid foundation for national IT controllability and self-reliance. Through progresses in architectural design, performance optimization and ecosystem development, Loongson Technology achieves a leap forward from "usable" to "powerful". Its independent innovation capability and industry enabling have made it a representative in Chinese independent CPU development.
Outstanding Secure Computing Innovation Award: China Greatwall Technology Group Co., Ltd.
China Greatwall is deeply engaged in IT core sectors and committed to building a secure, reliable, and independent computing and storage system. Making significant strides in servers, systems and security products, it has gained a strong presence in finance, telecommunications, energy, and government applications. With its innovative integration in in-house chips, operating systems, and complete system solutions, China Greatwall is making crucial contributions to the deployment of secure computing and growing to be a leading domestic power in high-quality development of IT.
Outstanding Packaging & Testing Intelligent Manufacturing Equipment Award: Shenzhen Like Automation Equipment Co., Ltd. (LKAUTO)
With deep expertise in semiconductor packaging and testing automation, LKAUTO is forging ahead with continuous progress in ball planting, visual inspection, and intelligent equipment, developing high-efficiency automation solutions covering the back-end packaging process. Its equipment stands out in enhancing production efficiency, yield stability, and quality assurance, and is widely applied in memory and high-end chip packaging and testing lines. Through ongoing innovation in precision processes, automation control, and intelligent inspection, LKAUTO continues to advance the capabilities of domestically developed packaging and testing equipment, playing a vital role in upgrading intelligent manufacturing across the industry.
Outstanding Packaging Process Equipment Innovation Award: Shenyang Heyan Technology Co., Ltd.
Heyan Technology is an expert in R&D of semiconductor packaging equipment. It makes steady breakthroughs in wafer dicing, thinning, tape peeling, tape mounting, and cleaning, providing high-precision and high-reliable solutions for advanced packaging and storage manufacturing.
Its technologies significantly enhance process stability and yield, accelerating equipment localization and strengthening the high-quality development of the semiconductor ecosystem.
Outstanding Customer Service and Trust Award: Topdisk Technology Limited
TOPDISK, guided by a "customer-centric" philosophy, provides comprehensive pre-sales, in-sales, and after-sales services through its TOPDISK and SmartFlash brands. Offering customized storage solutions for industrial, AI, and consumer applications, TOPDISK ensures reliable delivery and quality management while providing value-added services like design, consultation and training. Its commitment to professionalism and reliability earns global customer trust.
Outstanding Intelligent Manufacturing R&D Award: Shenzhen KingSpec Electronics Technology Co., Ltd.
KingSpec is driving innovation in intelligent manufacturing with its self-developed ZS101 universal storage testing system. Featuring a breakthrough "five-in-one" architecture, the system cuts SSD test plug-in cycles from 10 to 2, a 75% boost in efficiency. Supporting both SATA and NVMe testing in parallel, it integrates high-temperature zones, remote centralized control, and MES connectivity to enable full-process visualization and traceability. By redefining industry testing standards and processes through in-house innovation, KingSpec is not only improving production efficiency and yield but also contributing to the evolution of the global storage manufacturing ecosystem.
Outstanding Storage Die Bonding Equipment Award: Microview Intelligent Packaging Technology (Shenzhen) Co., Ltd.
Microview follows the strategy of "Product Leadership, Efficiency-Driven Growth, and Global Reach." Over the past five years, it has grown into a leading domestic provider of high-precision die bonding machines. Its core competitiveness lies in innovation. The company holds full independent intellectual property rights and has developed its own motion control platform, machine vision algorithms, and key components, achieving remarkable advantages in both performance and cost. With five global centers providing 24/7 support and collaboration with top clients, Microview delivers performance and cost advantages, driving intelligent packaging innovation.
Outstanding Semiconductor Precision Process Equipment Award: Suzhou Maxwell Technologies Co., Ltd.
In the field of semiconductor packaging, Maxwell Technologies adheres to continuous R&D and innovation, followed by an integrated strategy of "core components, key consumables, high-end equipment, and advanced processes." The company has successfully localized multiple ultra-precision semiconductor wafer grinding, dicing, and bonding systems. Its independently developed key equipment achieves international-level standards in stability, precision, and process adaptability, with several products marking domestic firsts and entering major semiconductor manufacturers for process validation. Through cutting-edge technology and reliable performance, Maxwell Technologies drives the localization and performance enhancement of semiconductor manufacturing equipment.
Outstanding SSD Power Management IC Application Award: Silergy Corp.
Silergy has long been dedicated to innovation in power management technologies, offering highly efficient and integrated PMIC solutions widely adopted in client SSDs. With its leading architecture design and outstanding reliability, Silergy's products have been deployed in over one billion SSDs worldwide, significantly enhancing power efficiency, stability, and energy management performance. Through continuous iteration in large-scale applications, the company keeps delivering superior user experiences for storage devices and has earned broad recognition from customers across the globe.
Outstanding Semiconductor Metrology Equipment Innovation Award: Skyverse Technology Co., Ltd.
Skyverse is a pioneer in high-end semiconductor quality control, offering end-to-end yield management solutions that combine precision equipment, intelligent software, and professional services. By breaking through key technologies in nanometer defect inspection and 3D profile metrology, film thickness measurement, overlay error analysis, and critical dimension metrology, the company has localized multiple product lines now in mass production, empowering front-end fabs and advanced packaging plants across China. Its innovation-driven approach continues to strengthen the nation's self-reliance in semiconductor inspection and measurement.
Outstanding Advanced Packaging Lithography Equipment Innovation Award: AMIES Technology Co., Ltd.
AMIES is a key force in the R&D and manufacturing of advanced packaging lithography equipment in China. The company has mastered critical technologies such as high-speed, high-precision workpiece stages and large-field, high-resolution exposure systems. Its advanced packaging lithography systems are purpose-built for the lithographic needs of heterogeneous integration and high-density interconnects in AI and HPC chips, marking significant breakthroughs in memory manufacturing and providing strong support for supply chain independence. With continuous innovation in optical systems, precision control, and process applications, AMIES has filled critical domestic technology gaps and is emerging as a leading driver of China's semiconductor equipment localization and high-quality development.
Outstanding Semiconductor Packaging Material Technology Innovation Award: Shenzhen Hemei Jingyi Semiconductor Technology Co., Ltd.
Heimei Jingyi has invested substantial resources and capital in 2024–2025 to enhance product precision through intensive R&D. The company has achieved mass production in three-layer PCB manufacturing, aligning with the semiconductor packaging industry's trend toward thinner, smaller, lighter, and finer designs. Its products have entered large-scale production for DDR, eMMC, LPDDR, UFS, and ePOP applications, while logic and RF categories have moved into sample and small-batch production stages. Adhering to the philosophy of "quality first and customer foremost," Heimei Jingyi remains fully committed to providing customers with exceptional products and service.
Outstanding Test System Equipment Award: Tytantest Co., Ltd.
Tytantest focuses on developing advanced testing equipment for semiconductor memory and SoC applications. Its product lineup, including ATE systems, burn-in testers, and SSD/DRAM module testers, has achieved mass production at major domestic manufacturers. By innovating across testing algorithms, hardware architecture, and reliability design, Tytantest delivers high-performance and stable solutions, accelerating the advancement of China's memory testing ecosystem.
Outstanding Semiconductor Packaging Equipment Application Award: Dongguan Attach Point Intelligent Equipment Co., Ltd. (APIE)
APIE specializes in the R&D and manufacturing of semiconductor packaging equipment solutions, covering key packaging links of SSD and DRAM modules. With prominent advantages in automation, precision, and compatibility, its products have achieved scale applications in several mainstream module and packaging enterprises at home and abroad. By combining reliable delivery with continuous innovation, APIE enhances the localization and competitiveness of China's semiconductor packaging industry.
Outstanding Storage Test System Gold Award: Suzhou OKN Technology Co., Ltd.
OKN Technology leverages its deep expertise and continuous innovation in memory testing systems to pioneer advanced solutions, including the PCIe 5.0 SSD test system and DDR5 RDIMM test system, both developed with fully independent intellectual property rights. Its portfolio spans NAND, DRAM, and protocol-level testing, offering customers versatile, high-performance solutions that ensure product quality and reliability. Serving major players in China's memory industry, OKN continues to empower the domestic semiconductor supply chain through innovation and excellence.
Outstanding Storage Packaging & Testing Market Performance Award: Greater Bay Advanced Technology Co., Ltd. (GBAT)
GBAT has been deeply engaged in memory chip and module packaging and testing. With stable mass-production capability and high-standard automation, it has become a key player in China's high-end memory packaging and testing market. Its products are widely used in demanding scenarios such as AI smartphones, AI PCs, and AI wearables, while automotive- and industrial-grade memory products have passed audits by leading industry customers. Through continuous innovation in R&D and manufacturing, GBAT actively drives improvements in the reliability and performance of domestic memory chips, injecting new momentum into advanced packaging, testing, and the broader memory ecosystem.
Outstanding AI Computing Innovation Award: Beijing Xingyun Integrated Circuit Co., Ltd.
Dedicated to advancing AI inference chip innovation, Xingyun IC launched the "Qiming" series which stands out for its superior energy efficiency, high compute density, and outstanding adaptability across real-world applications—from smart security to industrial vision and edge intelligence. Following a high-efficiency, low-power, and easy-deployment design philosophy, Xingyun IC is breaking through edge AI performance limits and accelerating the localization of China's AI hardware-software ecosystem, powering a secure and intelligent digital future.
Outstanding AI Storage Innovation Award: Yanxin Microelectronics (Shanghai) Co., Ltd.
Yanxin Microelectronics pioneers next-generation memory solutions for AI and high-performance computing. From ReRAM embedded memory to standalone and computing-in-memory architectures, the company delivers high-performance, low-latency, and energy-efficient IP and tailored solutions that help AI chipmakers push past the "memory wall." By advancing synergy between computing and memory, Yanxin Microelectronics is powering the next leap in AI efficiency and strengthening China's innovation in core semiconductor technologies.
The GMIF2025 Annual Awards spotlighted the forefront of innovation shaping the global memory industry. The memory gala not only celebrated technological excellence but also fostered deeper dialogue between international leaders and China's rising innovators. From breakthroughs in advanced technologies to progress in localization and ecosystem collaboration across packaging, testing, and materials, this year's winners embody the spirit of "AI Applications, Innovation Empowered," driving both global digital transformation and China’s growing leadership in the memory sector.