INTRODUCTION
Conference Introduction
To further implement the national, provincial, and municipal IC industry planning and policies, create a favorable industrial development environment, promote the high-quality, innovative development of the Shenzhen industry, and help Guangdong Province to build the "third pole" of China's IC industry, Shenzhen, Shenzhen Municipal People's Government, together with the China Semiconductor Industry Association IC Design Branch and the National Science and Technology Special Project Expert Group of "Core electronic devices, high-end general-purpose chips, and basic software products," will jointly organize the "2022 China (Shenzhen) IC Summit" from November 11th to 12th(Due to the current epidemic situation, the ICS2022 Summit will be postponed until further notice), 2022, in Pingshan, Shenzhen (hereinafter referred to as ICS2022 Summit).

ICS2022 Summit, with the theme of "Innovative Technology and Supply Chain, Dual Drivers for Chip Development," will gather distinguished academicians, experts, scholars, technology experts, and business leaders from home and abroad to discuss the opportunities of IC technology and industrial application innovation, industry chain ecosystem and security mechanism construction, international situation analysis and collaborative development, technology evolution trend and popular applications, capital integration and operation model innovation, and the integration of chip and machine industries. The forum will discuss the industrial development opportunities under the new situation and help China build its edges in innovation and growth to expedite the construction of a powerful country in science and technology. On top of the summit forum, ICS2022 will feature a new main forum, the Global Memory Industry Innovation Forum, with the theme of "Start from Requirements to Seek Win-Win Results in Innovation," to dock with global memory manufacturers and markets. The discussion will focus on the construction of a worldwide memory innovation ecosystem.

ICS2022 Summit adopts the model of "1+2+3+10", which consists of a global live streaming, two main forums (Summit and Global Memory Industry Innovation Forum), three private sessions, and ten parallel thematic forums (see Annex 2 for the specific agenda). The live streaming and remote participation will be realized through online and offline synchronization. There will be a technology and product exhibition during the conference, and the news media will conduct on-site interviews and reports on the exhibitors, exhibition activities, and exhibits.
GMIF2022 Overview
In 2021, the problem of a shortage of chips swept the world. The semiconductor industry chain ushers in a new reshaping round, and the storage industry faces enormous opportunities and challenges. On the one hand, social production and living speed up towards online and digital, personal terminals, cloud computing, AI, etc., call for massive data storage needs, driving the storage market to expedite growth. On the other hand, under the post-pandemic era, coupled with the Russia-Ukraine war, end demand is encountering more significant uncertainty, and the adverse effects of panic at the early stage are progressively emerging.

What opportunities and uncertainties will China ecounter as a major global storage market? How will the storage market further evolve in the future? What new technologies, applications, and cooperation will emerge in the storage industry? How can global companies in the storage industry chain achieve synergy, complementarity, and development? The answers to these questions could be found at the upcoming Global Memory Innovation Forum (GMIF2022) on July 7th(now it's postponed to October 25th).

The GMIF will focus on the "dual-driver" value of the key innovative technology-driven memory chips and the security-driven memory of the industry supply chain, grasping the significant historical opportunity of Shenzhen's "dual-driver" construction and Guangdong Province to become the "third pole" of China's IC industry. The forum will include mainstream industry manufacturers (terminals, wafers, SoC, modules, packaging and testing, and materials), new memory startups, investors, and more to discuss the global memory industry chain's innovation, development, and synergy.

This forum aims to build an international and professional communication platform for the global memory industry to discuss new technologies, applications, cooperation, and opportunities. The forum is dedicated to providing communication opportunities for upstream and downstream manufacturers in the storage industry, consolidating the synergy and complementary development among industry partners, helping participating companies promote their products and brands, and empowering the global memory industry chain to win together!
HIGHLIGHTS
Focus on storage industry innovation
Advanced technology, leading process, market strategy, new product application, industry foresight ...
Special live streaming to reach global customers
Global well-known terminal manufacturers, overseas agents/distributors and individual visitors, covering 39+ countries (regions included) worldwide
30+ media, multi-channel communication
30+ industry media platforms, through 200,000+ engineers and upstream & downstream enterprises of the storage industry chain
Explore the road of win-win development of the industry
Explore the path of memory business development; connect capital and enterprises; foster a prosperous memory industry ecosystem
The gathering of higher-ups provide a diversified communication platform
Original factories, platform factories, module factories, investment institutions ...; corporate decision-makers, procurement, sales, engineers ...
SPEAKERS
Mr. Tao Huang
President Flash Storage Domain
Huawei Technologies Co., Ltd.
Mr. Gary Gao
General Manager of Technology Department, China.
Intel Corporation
Mr. Feng Chen
Senior Vice President
Rockchip Electronics Co., Ltd.
Mr. Jian Shen
Senior Vice President
Powerleader Computer SYSTEM CO.,Ltd.
Mr. Zhangde Lin
Global Purchasing Director
Foxconn Technology Group
Mr. Guizhen He
Materials Supervisor
ZTE Corporation
Mr. Changpeng Qin
Chief Engineer of ZTE Server and Storage Products
ZTE Corporation
Mr. Albert Chen
Senior Director of Sales, China Region
Silicon Motion, Inc.
Mr. Yiming Li
Director Solutions Architecture
Amazon Web Services
Mr. Sam Sun
Chairman
Biwin Storage Technology Co., Ltd.
Ms. Xiaoyu Dai
Chief Analyst
China Flash Markekt
Mr. Michael He
CTO
Payton Technology(Shenzhen)Co.,Ltd.
Mr. Shan Jiang
General Manager
Guangzhou Longxin Zhongke Electronic Technology Co., Ltd.
Mr. Fuchi Zhou
Chairman
Netac Technology Co., Ltd.
Mr. David Han
Regional Sales VP
Innogrit TECHNOLOGIES Co., Ltd.
Mr. Fei Shen
Chairman&General Manager
Beijing Starblaze Technology Co., Ltd.
Mr. Dong Cai
Vice President
Biwin Storage Technology Co., Ltd.
Mr. Jianqiang Wan
Southern Regional General Manager
Shanghai Stock Exchange
Mr. Zhanxiang Zhao
Partner &CTO
Winsoul Capital
Mr. Zhe Zhang
Vice President
Powev Electronic Technology Co., Limited
Mr. Jinliang Shen
Chairman
ShenZhen KingSpec Electronics Technology Co., Ltd.
Mr. Chen Xiu
China Country Manager
Beijing Tenafe Electronic Technology Co., Ltd.
Mr. Xiaolong Ouyang
Vice Dean of Research Institute
Dongguan Attach Point Intelligent Equipment Co., Ltd.
Mr. Aaron Xu
CTO
Tytantest
SPONSOR
189 2527 3911
DIAMOND SPONSORS
GOLD SPONSORS
SILVER SPONSORS
BRONZE SPONSOR
SUPPORTERS
Global Live Stream
agenda
Memory Industry Development Forum   DAY 1,13:30-18:00

 

13:30-14:00
Sign-in
14:00-14:20
Welcome Speeches
Mr. Zihe Huang/Mr. Shijiang Wang | China Semiconductor Industry Association, Assistant Secretary-General
Mr. Shengming Zhou | Shenzhen Semiconductor Industry Association, Honorary Chairman
Mr. Bing Zhou | Shenzhen Memory Industry Association, Honorary Chairman
14:20-14:40
Keynote Speech
Mr. Ming Liu | School of Microelectronics University of Science and Technology of China,Dean
14:40-15:00
Changing the Compute Landscape : Compute Express Link(CXL™)
Mr. Gary Gao | Intel Corporation,General Manager of  Technology Department, China
15:00-15:20
Opportunities and Challenges: AIOT in The SOC and Storage World
Mr. Feng Chen | Rockchip Electronics Co., Ltd.,Senior Vice President
15:20-15:40
Amazon Self-developed Technology Helps to Boost Storage Performance and Empower Innovation and Security
Mr. Yiming Li | Amazon Web Services,Director Solutions Architecture
15:40-16:00
Storage Market • Storage Ecosystem
Ms. Xiaoyu Dai | China Flash Markekt,Chief Analyst
16:00-16:20
Building a Memory Ecosystem and Moving Towards a Win-win Future
Mr. Albert Chen |  Silicon Motion, Inc.,Senior Director of Sales, China Region
16:20-16:40
BIWIN: From Chips to Clients, Exploring a Win-Win Route with Our Business Partners
Mr. Sam Sun | Biwin Storage Technology Co., Ltd.,Chairman
16:40-17:00
Challenges and Future Outlook of Advanced Packaging Technology and PTN’S Total Solution in Memory Products
Mr. Michael He | Payton Technology(Shenzhen)Co.,Ltd.,CTO
17:00-17:20
Sign-in
17:20-17:40
Sign-in
   Sub Forum( DAY 2, 8:30-17:00)

 

13:00-13:30
Sign-in
13:30-13:40
Welcome Speeches
13:40~14:00
Self-developed CPU & Independent Memory Ecosystem
Mr. Shan Jiang | Guangzhou Longxin Zhongke Electronic Technology Co., Ltd., General Manager
14:00~14:20
TBD
Mr. Fei Shen | Beijing Starblaze Technology Co., Ltd., Chairman&General Manager
14:20~14:40
Embracing Changes via Innovation
Mr. David Han | Innogrit TECHNOLOGIES Co., Ltd., Regional Sales VP
14:40~15:00
Round Table Discussion
Mr. Dezhang Lin | Foxconn  Technology Group, Global Purchasing Director
Mr. Weijin Zhang | Powerleader Computer SYSTEM Co., Ltd., Vice President of IT Innovation Business Unit
Mr. Guizhen He | ZTE Corporation, Materials Supervisor
Mr. Shan Jiang | Guangzhou Longxin Zhongke Electronic Technology Co., Ltd., General Manager
Mr. Feng Chen | Rockchip Electronics Co., Ltd., Senior Vice President
Mr. Huaan Yang | Silicon Motion, Inc., Product Development Executive, China Region
Mr. David Han | Innogrit TECHNOLOGIES Co., Ltd., Regional Sales VP
Mr. Fei Shen | Beijing Starblaze Technology Co., Ltd., Chairman&General Manager
Mr. Dong Cai | Biwin Storage Technology Co., Ltd., Vice President
Mr. Fuchi Zhou | Netac Technology Co., Ltd., Chairman
Mr. Zhe Zhang | Powev Electronic Technology Co., Ltd., Vice President
Mr. Jinliang Shen | ShenZhen KingSpec Electronics Technology Co., Ltd., Chairman
15:00~15:20
Lucky Draw
15:20~16:00
Craftsmanship Creates Product Built to Last
Mr. Chen Xiu | Beijing Tenafe Electronic Technology Co., Ltd., China Country Manager
16:00~17:00
Smart Chip-On-Glass Technology Featuring High Quality, Fast Speed and Great Reliability Helps to Upgrade the IC Packaging Industry
Mr. Xiaolong Ouyang | Dongguan Attach Point Intelligent Equipment Co., Ltd., Vice Dean of Research Institute
News
More
organization
Host Units
Shenzhen Municipal People's Government
China Semiconductor Industry Association IC Design Branch
General Expert Group of National Science and Technology Special Project of "Core electronic devices, high-end general-purpose chips and basic software products"
Organizers
Technology Innovation Commission of Shenzhen Municipality
Development and Reform Commission of Shenzhen Municipality
Industry and Information Technology Bureau of Shenzhen Municipality
Shenzhen Pingshan District People's Government
Co-organizers
Shenzhen Memory Industry Association
Shenzhen Semiconductor Industry Association
National IC Design Shenzhen Industrial Centre
Shenzhen Micro & Nano Institute
Shenzhen Softwarepark Management Center
Federation of Guangdong Academicians
School of Microelectronics (Southern University of Science and Technology)
Southern Venture Capital Network
Guidance Unit
China Semiconductor Industry Association
address
(Ruijing Road) Grand Skyline International Hotel Shenzhen Pingshan
No.36, Ruijing Road, Pingshan District, Shenzhen
Seek for Cooperation
Mr. Wang
+86 189 2527 3911
Mr. Huang
+86 186 1841 6028
Sign up for Viewing
Mr. Mo
+86 178 7812 5570
Forum exchange group
Forum Forum Exchange Group
Follow