Conference Introduction
To further implement the national, provincial, and municipal IC industry planning and policies, create a favorable industrial development environment, promote the high-quality, innovative development of the Shenzhen industry, and help Guangdong Province to build the "third pole" of China's IC industry, Shenzhen, Shenzhen Municipal People's Government, together with the China Semiconductor Industry Association IC Design Branch and the National Science and Technology Special Project Expert Group of "Core electronic devices, high-end general-purpose chips, and basic software products," will jointly organize the "2022 China (Shenzhen) IC Summit" from November 11th to 12th(Due to the current epidemic situation, the ICS2022 Summit will be postponed until further notice), 2022, in Pingshan, Shenzhen (hereinafter referred to as ICS2022 Summit).
ICS2022 Summit, with the theme of "Innovative Technology and Supply Chain, Dual Drivers for Chip Development," will gather distinguished academicians, experts, scholars, technology experts, and business leaders from home and abroad to discuss the opportunities of IC technology and industrial application innovation, industry chain ecosystem and security mechanism construction, international situation analysis and collaborative development, technology evolution trend and popular applications, capital integration and operation model innovation, and the integration of chip and machine industries. The forum will discuss the industrial development opportunities under the new situation and help China build its edges in innovation and growth to expedite the construction of a powerful country in science and technology. On top of the summit forum, ICS2022 will feature a new main forum, the Global Memory Industry Innovation Forum, with the theme of "Start from Requirements to Seek Win-Win Results in Innovation," to dock with global memory manufacturers and markets. The discussion will focus on the construction of a worldwide memory innovation ecosystem.
ICS2022 Summit adopts the model of "1+2+3+10", which consists of a global live streaming, two main forums (Summit and Global Memory Industry Innovation Forum), three private sessions, and ten parallel thematic forums (see Annex 2 for the specific agenda). The live streaming and remote participation will be realized through online and offline synchronization. There will be a technology and product exhibition during the conference, and the news media will conduct on-site interviews and reports on the exhibitors, exhibition activities, and exhibits.
GMIF2022 Overview
In 2021, the problem of a shortage of chips swept the world. The semiconductor industry chain ushers in a new reshaping round, and the storage industry faces enormous opportunities and challenges. On the one hand, social production and living speed up towards online and digital, personal terminals, cloud computing, AI, etc., call for massive data storage needs, driving the storage market to expedite growth. On the other hand, under the post-pandemic era, coupled with the Russia-Ukraine war, end demand is encountering more significant uncertainty, and the adverse effects of panic at the early stage are progressively emerging.
What opportunities and uncertainties will China ecounter as a major global storage market? How will the storage market further evolve in the future? What new technologies, applications, and cooperation will emerge in the storage industry? How can global companies in the storage industry chain achieve synergy, complementarity, and development? The answers to these questions could be found at the upcoming Global Memory Innovation Forum (GMIF2022) on July 7th(now it's postponed to October 25th).
The GMIF will focus on the "dual-driver" value of the key innovative technology-driven memory chips and the security-driven memory of the industry supply chain, grasping the significant historical opportunity of Shenzhen's "dual-driver" construction and Guangdong Province to become the "third pole" of China's IC industry. The forum will include mainstream industry manufacturers (terminals, wafers, SoC, modules, packaging and testing, and materials), new memory startups, investors, and more to discuss the global memory industry chain's innovation, development, and synergy.
This forum aims to build an international and professional communication platform for the global memory industry to discuss new technologies, applications, cooperation, and opportunities. The forum is dedicated to providing communication opportunities for upstream and downstream manufacturers in the storage industry, consolidating the synergy and complementary development among industry partners, helping participating companies promote their products and brands, and empowering the global memory industry chain to win together!